| Ögussa Classification | DIN EN 29453 1) DIN ISO 3677 | Solder Temperature | Melting Range | Key Applications |
| Silox® 145 | S-Sn50Pb32Cd18 | 190 °C | 145 °C | For very careful solder joints |
| Silox® 220 | S-Sn95,5Ag3,5 | 270 °C | 221—230 °C | Finest solder joints, food-safe |
| Silox® 180 | S-Pb50Sn50 | 265 °C | 183—215 °C | Soft solders for industry and craft |
| Silox® 200 | S-Sn50Pb48Ag2 | 265 °C | 183—215 °C | |
| Silox® 260 | S-Sn97Cu3 | 300 °C | 230—250 °C | Copper, brass, gunmetal, steel |
| Silox® 260/K 1) | S-Sn97Cu3 | 300 °C | 230—250 °C |
1) Filled with 1.1.2/DIN EN 29454-1, previously F-SW26/DIN 8511
Environmentally Friendly
Our Silox lead-free soft solders are compliant with the RoHS directive.
| Ögussa Classification | DIN EN 29453 | Solder Temperature | Melting Range | Key |
| Silox® 199 | S-Sn91Zn9 | 250 °C | 199 °C | For very careful solder joints |
| Silox® 208 | S-Sn91In8Ag4Bi1 | 255 °C | 197-208 °C | Solid wires or flux-filled cored solders with 2.5% flux for hand-soldering in electrical engineering and electronics. |
| Silox® 217 | S-Sn96Ag3Cu1 | 270 °C | 217-220 °C | |
| Silox® 218 | S-Sn95Ag4Cu1 | 265 °C | 217-218 °C | |
| Silox® 220 | S-Sn96,5Ag3,5 | 270 °C | 221 °C | |
| Silox® 222 | S-Sn98Cu1Ag | 280 °C | 217-227 °C | |
| Silox® 224 | S-Sn97Ag3 | 275 °C | 221-224 °C | |
| Silox® 227 | S-Sn99,3Cu0,7 | 280 °C | 227 °C | |
| Silox® 260 | S-Sn97Cu3 | 300 °C | 227-310 °C |
Delivery form:
Rods, wires and cored solders filled with flux (flux content 2.5%) in accordance with 1.1.2./DIN EN 29454-1 previously F-SW26 or other fillings
| Ögussa Classification | DIN EN 29453c | Solder Temperature | Melting Range | Key Applications |
| S-Sn60Pb38Cu2 | S-Sn60Pb38Cu2 | 190 °C | 183 - 190 °C | Electronic components, circuit boards |
| S-Pb60Sn40 | S-Pb60Sn40 | 230 °C | 180 - 235 °C | Wiring, sheet metal parts |
| Ögussa Classification | DIN EN 29454-1 | Application |
| Silox® F 7 | 3.1.1. | Soldering fluid concentrate for heavy metals and steels |
| Soldaflux® Z | 3.2.2. | Soldering fluid for stainless and scale-proof steel |
| Soldeen-1® | 3.1.1. | Universal soldering fluid for heavy metals other than stainless steel |
| Puradin® | 3.1.2. | Soldering grease for copper and copper alloys |
| Paros | 2.1.2. | Soldering grease for copper and copper alloys |
| Partus-25 | 2.1.2. | Viscous flux for copper and copper alloys |
Addendum:
The fluxes are selected depending on the base material and the working temperature of the solder. The working temperature and melting range of the solder should be identical to the working temperature range of the flux.
Flux residues are corrosive and should be removed carefully.
| Ögussa Classification | DIN EN 29454-1 | Application |
| Chemet® Z –02 | 3.1.1. | Soldering fluid for copper, copper alloys and lead (glazing) |
| Chemet® Z –04 | 3.2.2. | Soldering fluid for titanium zinc, refined zinc and galvanised sheet steel |
| Chemet® Z -04-S | 3.2.2. | Soldering fluid for titanium zinc and refined zinc, especially for construction site work |
| Chemet® A-014 | 3.2.2. | Soldering fluid for stainless steel |
Addendum:
The fluxes are selected depending on the base material and the working temperature of the solder. The working temperature and melting range of the solder should be identical to the working temperature range of the flux. Flux residues are corrosive and should be removed carefully.
