Soft Solders and Fluxes

Ögussa
Classification
DIN EN 29453
1) DIN ISO 3677
Solder TemperatureMelting RangeKey
Applications
Silox® 145S-Sn50Pb32Cd18190 °C145 °CFor very careful solder joints
Silox® 220S-Sn95,5Ag3,5270 °C221—230 °CFinest solder joints, food-safe
Silox® 180S-Pb50Sn50265 °C183—215 °CSoft solders for industry and craft
Silox® 200S-Sn50Pb48Ag2265 °C183—215 °C
Silox® 260S-Sn97Cu3300 °C230—250 °CCopper, brass, gunmetal, steel
Silox® 260/K 1)S-Sn97Cu3300 °C230—250 °C

1) Filled with 1.1.2/DIN EN 29454-1, previously F-SW26/DIN 8511

Environmentally Friendly

Our Silox lead-free soft solders are compliant with the RoHS directive.

 

Ögussa
Classification
DIN EN 29453                  Solder TemperatureMelting Range                    

Key
Applications                         

Silox® 199S-Sn91Zn9250 °C199 °CFor very careful solder joints
Silox® 208S-Sn91In8Ag4Bi1255 °C197-208 °CSolid wires or flux-filled cored solders with 2.5% flux for hand-soldering in electrical engineering and electronics.
Silox® 217S-Sn96Ag3Cu1270 °C217-220 °C
Silox® 218S-Sn95Ag4Cu1265 °C217-218 °C
Silox® 220S-Sn96,5Ag3,5270 °C221 °C
Silox® 222S-Sn98Cu1Ag280 °C217-227 °C
Silox® 224S-Sn97Ag3275 °C221-224 °C
Silox® 227S-Sn99,3Cu0,7280 °C227 °C
Silox® 260S-Sn97Cu3300 °C227-310 °C

Delivery form:    
Rods, wires and cored solders filled with flux (flux content 2.5%) in accordance with 1.1.2./DIN EN 29454-1 previously F-SW26 or other fillings

Ögussa
Classification
DIN EN 29453cSolder TemperatureMelting RangeKey
Applications
S-Sn60Pb38Cu2S-Sn60Pb38Cu2190 °C183 - 190 °CElectronic components, circuit boards
S-Pb60Sn40S-Pb60Sn40230 °C180 - 235 °CWiring, sheet metal parts
Ögussa
Classification
DIN EN 29454-1Application
Silox® F 73.1.1.Soldering fluid concentrate for heavy metals and steels
Soldaflux® Z3.2.2.Soldering fluid for stainless and scale-proof steel
Soldeen-1®3.1.1.Universal soldering fluid for heavy metals other than stainless steel
Puradin®3.1.2.Soldering grease for copper and copper alloys
Paros2.1.2.Soldering grease for copper and copper alloys
Partus-252.1.2.Viscous flux for copper and copper alloys

Addendum:
The fluxes are selected depending on the base material and the working temperature of the solder. The working temperature and melting range of the solder should be identical to the working temperature range of the flux.

Flux residues are corrosive and should be removed carefully.

Ögussa
Classification
DIN EN 29454-1Application
Chemet® Z –023.1.1.Soldering fluid for copper, copper alloys and lead (glazing)
Chemet® Z –043.2.2.Soldering fluid for titanium zinc, refined zinc and galvanised sheet steel
Chemet® Z -04-S3.2.2.Soldering fluid for titanium zinc and refined zinc, especially for construction site work
Chemet® A-0143.2.2.Soldering fluid for stainless steel

Addendum: 
The fluxes are selected depending on the base material and the working temperature of the solder. The working temperature and melting range of the solder should be identical to the working temperature range of the flux. Flux residues are corrosive and should be removed carefully.